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Agilent ACMD-7401 Miniature PCS Band Duplexer
Data Sheet
Features * Miniature size: less than 1.4 mm high, 5 x 5 mm footprint * Rx Band: 1930 - 1990 MHz typical performance: Description The ACMD-7401 is a miniaturized duplexer designed using Agilent's Film Bulk Acoustic Resonator (FBAR) technology. The ACMD7401 is the first duplexer built with Agilent's innovative Microcap bonded-wafer chip scale packaging technology. This process allows the ultra small filters to be assembled in a molded chip-on-board (MCOB) module that is less than 1.4 mm high with a 5 x 5 mm footprint. The ACMD-7401 enhances the sensitivity and dynamic range of CDMA receivers, providing more than 50 dB attenuation of transmitted signal at the receiver input, and more than 40 dB rejection of the transmit-generated noise in the receive band. Typical insertion loss in the Tx channel is only 1.8 dB, minimizing current drain from the power amplifier. Typical insertion loss in the Rx channel is 2.2 dB, improving receiver sensitivity. Agilent's thin-film Bulk Acoustic Resonator (FBAR) technology makes possible high-Q filters at a fraction their usual size. The excellent power handling of the bulk-mode resonators supports the high output powers needed in PCS handsets, with virtually no added distortion. Rx Noise Blocking: 44 dB Insertion Loss: 2.2 dB typical, 3.0 dB band edge * Tx Band: 1850 - 1910 MHz typical performance: Tx Interferer Blocking: 54 dB Insertion Loss: 1.8 dB typical, 2.5 dB band edge * 30 dBm Tx Power Handling
Applications * Handsets or data terminals operating in the US PCS frequency band
ACMD-7401 Electrical Specifications, ZO = 50, TC[1] as indicated Symbol Parameters
Path from Antenna Port to Receiver Port S23 S23 S23 S23 S23 S22 Attenuation in Transmit Band (1850.6 - 1909.4 MHz) Insertion Loss, lower band edge (1930.6- 1935 MHz) Insertion Loss, mid-band (1935- 1987 MHz) Insertion Loss, upper band edge (1987- 1989.4 MHz) Ripple in Receive Band Rx Port Return Loss in Receive Band Path from Transmitter Port to Antenna Port S31 S31 S31 S31 S31 S31 S11 S33 S21 S21 S21 Attenuation in Receive Band (1930.6 - 1935 MHz) Attenuation in Receive Band (1935- 1989.4 MHz) Insertion Loss, lower band edge (1850.6- 1853 MHz) Insertion Loss, mid-band (1853- 1907 MHz) Insertion Loss, upper band edge (1907- 1909.4 MHz) Ripple in Transmit Band Tx Port Return Loss in Transmit Band Antenna Port Return Loss, Tx and Rx bands Tx-Rx Isolation, 1850.6 - 1909.4 MHz (Transmit Band) Tx-Rx Isolation, 1930.6 - 1935 MHz (Receive Band) Tx-Rx Isolation, 1935- 1989.4 MHz (Receive Band) dB dB dB dB dB dB dB dB dB dB dB 40 40 -- -- -- -- 8.0 8.0 50 40 40 44 42 2.3 2.2 1.6 2.0 10 10 54 44 44 -- -- 3.0 3.0 3.0 2.5 -- -- -- -- -- 40 40 -- -- -- -- 8.0 8.0 50 40 40 42 42 2.3 2.2 2.4 2.0 10 10 54 44 44 -- -- 3.0 3.0 3.8 3.0 -- -- -- -- -- 37 40 -- -- -- -- 8.0 8.0 50 38 40 42 42 2.3 2.2 1.2 2.0 10 10 54 44 44 -- -- 3.6 3.0 3.0 3.0 -- -- -- -- -- dB dB dB dB dB dB 50 -- -- -- -- 8.0 54 2.6 2.2 2.8 1.5 10 -- 3.5 3.5 3.5 2.6 -- 50 -- -- -- -- 8.0 52 2.7 32.3 2.8 1.5 10 -- 3.5 3.0 3.8 3.0 -- 50 -- -- -- -- 8.0 52 3.2 2.2 2.7 2.0 10 -- 4.5 3.5 3.5 3.0 --
Units
+25C[1,3] Min Typ Max
+85C[1,2,3,4] Min Typ Max
-30C[1,2,3] Min Typ Max
Notes: 1. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board. Port 1 = Tx, Port 2 = Rx, Port 3 = Ant 2. Specifications are given at operating temperature limits and room temperature. To estimate performance at some intermediate temperature, use linear interpolation. 3. Specifications are guaranteed over the given temperature range, with the input power to the Tx port equal to +29 dBm (or lower) over all Tx frequencies. Upper transmit band edge maximum Insertion Loss at 85C is guaranteed to +26 dBm of input power. For higher input power, derate maximum temperature as: Tmax = 95C - 25C * Pin (Watts). Input power between +26 dBm and +30 dBm is safe, but the Insertion Loss at the upper transmit band edge will degrade slightly. 4. High temperature specifications are guaranteed with thermal pads in thermal contact with the motherboard. (See Figure 1.)
Thermal Pads ensure good thermal contact to the motherboard.
Figure 1. Underside of the duplexer.
2
0
-35 -40
S21 (Tx to Rx isolation), (dB)
-10
S31 (Ant-Tx), (dB)
-45 -50 -55 -60 -65
-20
-30C 25C 85C
-30
-30C 25C 85C
-40
-50 1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
-70 1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 2. Loss, Tx port to antenna port.
Figure 3. Isolation (Tx to Rx ports).
0
0
-10
S23 (Ant-Rx), (dB)
-20 -30 -40 -50 -60 1.82
-30C 25C 85C
S11 (Tx Return Loss), (dB)
-5
-10
-15
-30C 25C 85C
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
-20 1.82 1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00 2.02
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 4. Loss, antenna port to Rx port.
Figure 5. Return Loss, Tx port.
0
S22 (Rx Return Loss), (dB)
-5
-30C 25C 85C
-30C 25C 85C
-10
-15
-20 1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
Figure 6. Return loss, Rx port.
freq (1.850 GHz to 1.909 GHz)
Figure 7. Tx port impedance (8 dB circle).
3
0
S33 (Ant Return Loss), (dB)
-5
-30C 25C 85C
-30C 25C 85C
-10
-15
-20 1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
Figure 8. Return loss, antenna port.
freq (1.930 GHz to 1.990 GHz)
Figure 9. Rx port impedance (8 dB circle).
-30C 25C 85C
-30C 25C 85C
freq (1.850 GHz to 1.910 GHz)
freq (1.930 GHz to 1.990 GHz)
Figure 10. Antenna port impedance, Tx band (8 dB circle).
Figure 11. Antenna port impedance, Rx band (8 dB circle).
4
Applications Information
Agilent's ACMD-7401 duplexers provide high RF performance in a very small package. However, in order to achieve all the performance available from the duplexer, care must be taken in the design of the board onto which it is mounted. The purpose of this information is to provide Agilent's recommendations on the design of that board (called the motherboard in this note). Areas where care in design must be observed are thermal ground, RF ground, in/out connection design, and solder mask/solder stencil design. These four design areas, which are sometimes interrelated, will be considered one at a time below. Thermal Ground FBAR resonators have a negative temperature coefficient of frequency -- as temperature goes up, the frequency response of the filter shifts down in frequency. See Figure 12. Typical coefficients are 57 KHz/ C for the Tx filter and 40 KHz/ C for the Rx filter. In Figure 13, the same data are presented with the scale narrowed down to the upper end of the Tx band. Note that all these data are taken at low input power levels (+10 dBm). When input power is +29 dBm, heating in the Tx filter due to RF losses causes the filter membranes to heat up beyond 85C. This, in turn, causes the filter response to shift further left (down in frequency), resulting in increased insertion loss at the high end of the Tx band (1910 MHz). Agilent Technologies takes this into account in the manufacture and final test of the duplexer -- all specifications for insertion loss
(and other parameters) will be met at the specified input power level and motherboard temperature. Note that high power/high temperature testing done at Agilent is performed with the duplexer soldered down to a test board having a very good heat sink. The motherboard must be designed to remove heat from the duplexer with the lowest possible thermal resistance. Mount the duplexer on a large surface of 1/ ounce copper ground plane 2 (as shown in Figure 14), to enable
the heat to be removed in all directions. Via holes, necessary for RF grounding, should be filled with copper plating to further remove heat from the duplexer's Tx filter and dump it into a second ground plane located in a lower layer of the motherboard. FBAR duplexers have extremely low thermal mass and must be properly heat sunk, as well as isolated from external sources of heat (such as a nearby power amplifier). Failure to provide an adequate thermal design to cool
0
-10
S31 (Ant-Rx), (dB)
-20
-30
-30C 25C 85C
-40
-50
-60 1.82
1.86
1.90
1.94
1.98
2.02
FREQUENCY (GHz)
Figure 12. Tx Filter Response with Temperature.
0.0 -0.5
S31 (TX to Ant Loss), (dB)
-1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 1.845 1.855 1.865 1.875 1.885 1.895 1.905 1.915
-30C 25C 85C
FREQUENCY (GHz)
Figure 13. Tx Filter Response with Temperature (expanded).
5
the duplexer may result in degradation of insertion loss at the high end of the Tx band, or other performance issues. RF Ground Many of the same considerations, which apply to the thermal ground plane, also apply to the RF ground plane. A large surface ground area, as shown in Figure 14, provides data sheet performance for the duplexer. In addition, a series of 56 (or more) plated
and plugged via holes to a lower ground plane (0.25 to 0.30 mm in diameter) should be provided under the perimeter of the duplexer, as shown in Figure 15. The rectangular opening in the center of the duplexer ground plane (Figure 15) is strongly suggested. The 5 mm x 5 mm miniature FBAR duplexer has two via hole openings on the underside. They are DC insulated from any ground plane with a
patch of solder mask, but RF coupling to the ground may affect duplexer performance. Agilent Technologies recommends that the user remove the ground in the 1.0 x 1.4 mm rectangle shown. Note that the mounting includes a solder mask frame, 4.6 mm x 4.6 mm (shown in green). This solder mask assists with the alignment of the duplexer during soldering. Details of the input/output pads are shown in Figure 16.
0.5mm typ Hole spacing
-0.5
0.5
Duplexer (source of heat)
0.55 Rx -0.55 Tx
2.3 (solder mask) 0.25mm filled plated-thru hole, 56 places, on a See detail 0.5mm X 0.5mm grid 0.7 having 44 empty places. 0.25 0.0 Ref -0.7 -1.6
Ant
-2.3 (solder mask)
-2.3 (solder mask)
2.3 (solder mask)
0.55 0.0 Ref
Etched rectangle in the center of the pattern, 1.0mm X 1.4mm. Reference lines cross in the center of the duplexer. Green = solder mask Brown = exposed dielectric Gold = exposed conductor
-0.55
1.6
Figure 14. Thermal and Electrical Ground Plane.
.
Figure 15. Thermal and Electrical Ground Plane Details.
0.7 0.4
Input/output pad
0.35 0.4 0.35
Exposed dielectric (brown) Solder mask (green) Exposed ground plane ( ld)
Figure 16. Detail of Input/output Pads.
All dimensions are in mm
6
-1.6
In/out Connection Design High isolation between ports is a characteristic of Agilent FBAR duplexers, and values often exceed 50 dB. To achieve these isolation numbers, the user's motherboard must have 60 dB or more of isolation between each pair of the three input/output lines. This is measured as shown in Figure 17, using copper pins to short out all three of the lines to ground. Isolation is then measured between the Tx, Rx and Ant lines, with 60 dB as a minimum acceptable level. In order to achieve 60 dB of isolation in the motherboard itself using microstrip transmission lines, extreme care must be taken in the design due to the poorly contained field lines in microstrip. Ground areas between the lines and other good techniques will have to be used.
The use of coplanar waveguide over a groundplane (CPWG) provides for higher line-to-line isolation.
r CPWG (Coplanar waveguide)
Such transmission lines have excellent shielding, and line-toline values in excess of 80 dB can easily be achieved using this transmission line. Via holes are used to bring the signal down to the stripline conductor from the in/out pads on the surface. In order to obtain the maximum isolation between lines in the buried stripline layer, fill in the area between lines with large patches of copper, connected to the upper (and other) ground planes. Solder Mask and Solder Stencil Solder mask is used on all motherboards, to prevent solder from adhering to places where it is not desired. In mounting the duplexer, it serves as an aid to alignment during reflow soldering. The motherboard solder mask (shown in green in Figures 15, 16 and 17) is 4.6 mm x 4.6 mm, slightly smaller than the duplexer and corresponding to the metal pattern on the underside. This will contain the solder during reflow, and prevent the duplexer from rotating or slipping out of alignment while it is floating on molten solder. A solder stencil is used to print a pattern of solder paste onto the motherboard, with the duplexer placed upon this paste before the reflow process begins. The design of the solder stencil is critical to obtaining good yields in reflow soldering. The solder stencil pattern recommended by Agilent Technologies is shown in Figure 18, along with the recommended opening in the solder mask on the top surface.
Design guidelines for CPWG transmission lines can be found in AppCAD, the design/analysis software found on the Web at http://www.agilent.com/view/ appcad Better performance can be obtained using symmetrical stripline, where a buried conductor has a ground plane above and below.
r Stripline
Shorting pin, soldered to in/out pad and to ground on both sides, three places.
Figure 17. Motherboard Isolation Test Method.
7
Solder Materials The recommended solder profile for the FBAR duplexer is shown in Figure 20. Marking Code The marking code for the ACMD-7401 is as shown below:
1.9 1.2 0.6 2.4
Duplexer center line
0.4 typical 1.48
ABCDEFG
Rx
LLLLLLL TTTT t t t t RRRR r r r r
Tx
0.4 typical
0.6 1.3 1.9 2.4 1.25 Center line
Reference point, internal pattern Notes: All dimensions in mm. Gray = solder mask Dark gray = solder (0.004" thick) The pattern of 24 square solder pads and the opening in the gray solder mask are symmetrical about the two center lines.
Ant
A = Device Code (U = USPCS, G = GSM) B = Manufacturing location C = Year (3 = year 2003) DE = Workweek F = PCB Manufacturer G = PCB Revision LLLLLLL = Lot# TTTTtttt = TTTT Wafer lot #, tttt wafer # RRRRrrrr = RRRR Wafer lot #, rrrr wafer #
3.9 3.7 3.2 2.7 2.6 2.3
0.2 typical
1.9 1.6 1.4 1.4 1.5 1.1 1.0 1.0 0.6 0.2 2.2 0.5 2.1 2.9 2.4 3.4
0.5 1.0 1.4 1.9 0.5 1.0 1.4 Reference point
Internal pattern
Figure 18. Solder Mask/Solder Stencil.
8
4.0 3.0
BOTTOM VIEW
2.0 1.0
Green is area covered by solder mask Gold is contact pad Gray is exposed PCB material Black is filled via holes All dimensions in mm Tolerance is 0.1mm Pin assignments are shown in red
Tx
3.2 1.8 1.0
Rx
2.7 3.1
4.8 5.0
1.9 0.6
2.3
Ant
0.2 0.6 1.9 2.3 2.7 3.1 4.4 4.8 5.0
0.2
SIDE VIEW
1.4 max.
5.0
Figure 19. Outline drawing.
Solder Compositions
Shaded line is the alloy type recommended by Agilent Technologies. Alloy type
Sn42Bi58 Sn43Pb43Bi14 Sn63Pb37 Sn60Pb40 Sn91/Zn9 Sn96.2Ag2.5Cu0.8Sb0.5 Sn95.8Ag3.5Cu0.7 Sn96.5Ag3.5
300
Melting temp. (oC)
138 144 - 163 183 186 199 216 217 221
Recommended working temperature (oC)
160 - 180 165 - 185 200 - 240 200 - 240
TEMPERATURE (C)
250
200
150
100
50
200 - 240 235 - 255 235 - 255 240 - 260
0 0 50 100 150 TIME (seconds)
Tested profile shown.
200 250 300
Figure 20. Recommended Solder Profile.
9
A B
E
SPK
D
FRONT VIEW
BACK VIEW SPECIFICATION
SIDE VIEW F G 0.2 13.50 H (min) 20.20 ARBOR HOLE
H
TAPE A B WIDTH MAX +1.5-0.0 12mm C1 TAPE SLOT PLANE VIEW 18.00 12.4
C1 0.5 4.40
D 0.5 55.0
E F (max) (min) 178 1.50
G
Note: Surface resistivity to be <1012 Ohms/square
Figure 21. Reel Dimensions (all dimensions in mm).
P10 T
1.40 REF
0.20 P2 P0 D0
A
E
1234567 0000002 T123456 R123456
W F
6 B0 SECTION A-A
B A D1
B P1 A0 6
SYMBOL SIZE (mm) A0 B0 D0 D1 K0 K1 P1 P0 P2 P10 E F T W 5.40 0.10 5.40 0.10 0.10 1.50 + 0 - 1.60 0.10 1.900.10 1.500.10 8.000.10 4.000.10 2.000.10 40.000.20 1.750.10 5.500.10 0.300.30 12.000.30
K0 K1 SECTION B-B
45REF
Notes: Allowable camber to be 1 mm per 100 mm in length. All dimensions in mm.
Figure 22. Tape Dimensions (all dimensions in mm).
10
Sprocket holes
ABCDEFG LLLLLLL TTTTtttt RRRRrrrr
ABCDEFG LLLLLLL TTTTtttt RRRRrrrr
Pocket cavity Package pin 1 orientation
Figure 23. Unit Orientation in Tape.
Ordering Information Part Number
ACMD-7401-BLK ACMD-7401-TR1
No. of Devices
100 1000
Container
Anti-static bag 7" Reel
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. May 25, 2004 5989-0533EN

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